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Process flow of the mixed-signal 3D-IC with via-last/backside-via
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Imec, ARM demonstrate backside power delivery
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3D-IC Design Challenges and Requirements
Process flow of the mixed-signal 3D-IC with via-last/backside-via TSV
Frontiers Spiking CMOS-NVM mixed-signal neuromorphic ConvNet with circuit- and training-optimized temporal subsampling
Keeping IC Packages Cool
Metal Thin Films for Contacts and Interconnects
3D-IC Design Challenges and Requirements
Manipulation of single cells via a Stereo Acoustic Streaming Tunnel (SteAST)
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